Electronics Engineering Services
Today's high density designs require performance in much smaller areas than a conventional design. Blind vias, buried vias, stacked microvias and via-in-pad are sometimes required when there is room enough for components only. Laser drilling and cutting are typical with these types of designs, as well as routing of 0.075mm width trace & space. A higher end board shop will be required to produce these designs.
Today's high speed designs require trace lengths to be matched so the signals can reach their destination within a "window" or clock cycle. In addition to length matching, most high speed designs today also include differential pairs for noise immunity. Careful attention must be given to these signals to ensure they are over solid reference planes and that they are not running parallel to traces on adjacent layers. Timing is everything.